JPH079433Y2 - 筐体構造 - Google Patents
筐体構造Info
- Publication number
- JPH079433Y2 JPH079433Y2 JP9868489U JP9868489U JPH079433Y2 JP H079433 Y2 JPH079433 Y2 JP H079433Y2 JP 9868489 U JP9868489 U JP 9868489U JP 9868489 U JP9868489 U JP 9868489U JP H079433 Y2 JPH079433 Y2 JP H079433Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- shaped
- tongue
- heat sink
- projecting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9868489U JPH079433Y2 (ja) | 1989-08-22 | 1989-08-22 | 筐体構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9868489U JPH079433Y2 (ja) | 1989-08-22 | 1989-08-22 | 筐体構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0338689U JPH0338689U (en]) | 1991-04-15 |
JPH079433Y2 true JPH079433Y2 (ja) | 1995-03-06 |
Family
ID=31647768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9868489U Expired - Lifetime JPH079433Y2 (ja) | 1989-08-22 | 1989-08-22 | 筐体構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH079433Y2 (en]) |
-
1989
- 1989-08-22 JP JP9868489U patent/JPH079433Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0338689U (en]) | 1991-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4215361A (en) | Winged self-fastened heat sinks for semiconductor devices | |
US5179506A (en) | Securing component arrangement | |
JP2004274018A (ja) | 配線基板収容装置及び放電灯点灯装置 | |
US5489805A (en) | Slotted thermal dissipater for a semiconductor package | |
JPH079433Y2 (ja) | 筐体構造 | |
JPS6291495U (en]) | ||
JP2015104183A (ja) | 回路構成体およびdc−dcコンバータ装置 | |
JP2001061270A (ja) | 電源装置 | |
JP2003523620A (ja) | 装置に押し付けられる集積部品をもつヒートシンク | |
JP4243915B2 (ja) | スイッチング電源 | |
JPH0396088U (en]) | ||
KR20010011098A (ko) | 세탁기용 인쇄회로기판의 방열구조 | |
JPH08733Y2 (ja) | コイルの放熱構造 | |
JP3627502B2 (ja) | 電源装置 | |
JPH039597A (ja) | 回路基板の放熱構造 | |
JPH11233977A (ja) | 電子機器の放熱構造とこの放熱構造を用いた電源装置 | |
JP3086862U (ja) | ディスク装置の放熱構造および電気機器の放熱構造 | |
JPH0631194U (ja) | 混成集積回路装置 | |
JPH0396089U (en]) | ||
JPH0679173U (ja) | 回路基板 | |
JP2830686B2 (ja) | 電子機器 | |
JPH01104039U (en]) | ||
JP2823186B2 (ja) | 電子機器 | |
JPH11135693A (ja) | 電子素子パッケージをヒートシンクに取り付ける器具 | |
JPH0233445U (en]) |